A die attach film (DAF) is a material that is used to attach dies to a substrate or lead frame during the die attach manufacturing step in the semiconductor IC assembly process, and the DAF UV laser half cut is a manufacturing step in the semiconductor IC assembly process, and the cutting performance affects the die bond chip pickup yield. Therefore, the optimization of laser half cut parameters is very important. In this work, different laser parameters were studied to find the significant factor parameters followed by the fine tuning of the optimization condition. Experimental results showed that the laser power and cutting feed speed are the significant parameters for achieving laser cutting quality. According to the design of experiment (DOE) results, in the laser power range of 0.5–0.8 W, the cutting feed speed range is 45–65 mm/s and the grooving depth is 15–20 µm, which are the optimized conditions of a 20-µm-thick DAF.