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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 34, Number 10(3) (2022)
Copyright(C) MYU K.K.
pp. 3911-3921
S&M3085 Research Paper of Special Issue
https://doi.org/10.18494/SAM4030
Published: October 31, 2022

Molecular Dynamics Simulation of Thermomechanical Properties of Hollow Palladium Nanoparticle Pairs during Additive Manufacturing [PDF]

Ling-Feng Lai, Deng-Maw Lu, and Jian-Ming Lu

(Received July 4, 2022; Accepted September 27, 2022)

Keywords: molecular dynamics simulation method, nanoparticle pairs, additive manufacturing, coalescence temperature, melting temperature

A molecular dynamics (MD) simulation method with the embedded atom model (EAM)/alloy potential was used to investigate the thermomechanical properties of nanoscale hollow palladium (Pd) nanoparticle pairs during additive manufacturing (AM). The purpose was to explore and analyze hollow Pd nanoparticle pairs at room temperature obtained by AM. The thermomechanical properties of the hollow Pd nanoparticle pairs were discussed with the aim of proposing optimal parameters. It was shown that the nanoscale coalescence temperature of Pd was in the range of 750 to 1530 K and the nanoscale melting temperature was from 1414 to 1600 K, which were much lower than the macroscopic melting point (1828.05 K) of Pd. It was found that solid-state sintering can occur spontaneously at room temperature. The size and geometrical structure of the nanoparticles and the heating rate played important roles during AM.

Corresponding author: Jian-Ming Lu


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Cite this article
Ling-Feng Lai, Deng-Maw Lu, and Jian-Ming Lu, Molecular Dynamics Simulation of Thermomechanical Properties of Hollow Palladium Nanoparticle Pairs during Additive Manufacturing, Sens. Mater., Vol. 34, No. 10, 2022, p. 3911-3921.



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