Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 34, Number 9(2) (2022)
Copyright(C) MYU K.K.
pp. 3491-3502
S&M3055 Research Paper of Special Issue
https://doi.org/10.18494/SAM3926
Published: September 14, 2022

Impact of Improved Wire Tension Stability on Wire Electrical Discharge Machining Precision [PDF]

Pi-Wen Wang and Chao-Lun Liu

(Received March 29, 2022; Accepted June 13, 2022)

Keywords: WEDM, wire transport system, wire tension, straightness

We propose a system dynamic approach for improving the stability of wire electrical discharge machining (WEDM). The approach includes wire spool inertia isolation and a damped sandwich mechanism, which increase the fundamental frequency and damping coefficient of the system, respectively. Thus, the wire tension stability is also improved. We establish a dynamic model to simulate the dynamic behavior of the wire transport system. Then the wire tension stability is optimized through tuning the damping material parameters of the damped sandwich mechanism. The mechanism was mounted on a commercial WEDM machine to show the benefits in terms of wire tension and machining precision. Results show that the maximum overshoot of wire tension was reduced by 51% and the steady-state wire tension variation was improved from 176 to 48 gf. When cutting 10-cm-thick SKD11 tool steel, the deviation from a straight line was reduced by 45%.

Corresponding author: Pi-Wen Wang


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Pi-Wen Wang and Chao-Lun Liu, Impact of Improved Wire Tension Stability on Wire Electrical Discharge Machining Precision, Sens. Mater., Vol. 34, No. 9, 2022, p. 3491-3502.



Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.